Latest news 17.05.2010
From 10.August 2009 we have new owner.
Now we are,
, part of the
systems, GmbH., Augsburg, Germany
New model of wire saw
- in production
( improvement driving, graphical display, animation, automatic slurry distributors cleaning )
Special materials slicing - developing new technology
New model of wire saw machine, used BD technology, 
- for slicing wafers with diameter until 450 mm
New cropping machine 
- for cropping ingots with diameter until 340 mm
New model of squaring machine
- in testing and qualification
( New driving, graphical display, animation, automatic ingot centering )
Optimization of squaring process and full automatic squaring machine design
International Conference
SILICON 2010
- November 2. - 5. 2010 in Roznov p.Radh., Czech Republic - call for papers
Beginning from models
and
is used new PLC ABB -
AC 500 and drivers Control Techniques -
UNIDRIVE SP
-
Advanced Wire Saw
Machines
- Third generation of wire saw machines designed and produced in Czech Republic by the team of Karel Vojtechovsky.
- Machines & Technologies are designed on the base of new researches of this team or on the news of world science.
- Machines are ready use slurry on the oil, glycol and water base too.
- AWSM wire saw machines are ready slice wafers with by using wire with diameter from 120 microns, maximal length of wire is 600 km.
- Designed winding system give possibility use slicing or cutting wire more times.
- Machines are characterized using of world wides construction elements with especial details from the kitchen of design group.
- Part of principles and technological basses are object of patents and inventions.
wire winding and wire slicing technology using both directional wire moving.
- This technology minimized Taper of wafers is optimal for slicing wafers with lager diameter, up 200 mm.
- Slicing processes are not back & forth, generally are smooths.
- According used principle are life times of wire guides, bearings and other parts ofmachines longer then standard.
- BD technology give possibility design machines and slice blocks or ingots with notlimited one dimension ( slicing longer block or ingots lengthways, slim roods etc.).
- Technology and BD winding principles are patented. This principles and technology are used in machines AWSM 4800.1 , AWSM 8400.0
Now we design new Fully Automation Squaring Machine
for squaring single crystal ingots with lengths to 900 mm. Squaring process is fully automatic including centring ingot and squaring process too. Machine is ready square ingots to max. diameter 250 mm, squared blocks max. dimension 200 x 200 mm x mm.
specialised software for DAta COllection and VIsualization. Software is specialised and is standard part of
wire saw machines
List of interested patents - design of wire saw machines and slicing technology
Copyright (c) 2010 K.Vojtechovsky
Advanced Wire Saw Machine AWSM gallery
powered by Gemtree Software and The Peter system
Silicon 2010 - traditional biennial meeting of specialists in the technological field of semiconductor silicon production
To this time 14442 visitors